Products - UNDER CONSTRUCTION

The ZapperBox

1) Fracture Marking

Challenge

Conventional fracture marking methods  (High R-ratio blocks) do not work well with metals like Ti, nor at near threshold conditions.

Innovation

Local Heat Tint using electric pulse promises good observability in heat- tintable materials all the way down to threshold levels.


2) Local Heat Tint Technique

Local current density with 1/√r singularity at tip
Local resistance heating proportional to 1/r
Steep linear temperature gradient near tip

Can be tailored to size local tint zones

3) Electrical Field Analogous to Mode III

Analogous to deformation, we can express the singular voltage field in terms of a scalar multiplier.


Franc3D updated to obtain accurate KE

4) Proof of Concept: High Amp Pulse in Ti Foil

Digitally enhanced tint colors from oxide layer film.

Tint radius 0.14 inch—100x larger than required to mark.

Asymptotic Electrothermal solution developed to enable temperature control.



5) Crack-tip Temperature Control

Franc3D/Mode III handbook solutions used to obtain KE solution.
Steady-state thermal solution depends on external boundary conditions.
Local Transient thermal solution insensitive to external boundary conditions.
High-Amp transient electric pulses renders local thermal response largely geometry independent for given (KE, tpulse), and enables sharp tint lines.

KE and transient thermal solutions built-in to FractureLab software to enable precision crack tip heating/local tinting for common specimens.

6) System Architecture & Schematics


8) The Takeaways

The

•4000 Amp, precision pulse capability
115 lbs, 19”inch rack mount or wheels
Windows compatible software

9) Flagship Products & Services

Portfolio of products for exploratory research requiring High Ampere, Short Duration Pulse
Series 4000 for Entry Level Marking
Series 5000 for Premium Marking CapabilityCustom Configuration for Special Application
Fully supported with Consulting Services 

Possible Applications

Crack growth threshold testing.
Study of microstructural fracture mechanism.